Smart Watt Energy's engineering team completed a detailed energy audit (DEA) at the facility, then proposed improvements which included 109 lights being retrofitted, a majority of which were metal halides, to led linear high bay light. Occupancy sensors were added to most of the lights, resulting in additional energy savings.
David Johnson, Plant Manager for NOR-AM Cold Storage Logistics believed that, "Upgrading technology and generating energy savings is a win-win situation. The improvements are estimated to save more than $14,132 annually, which would pay for the project in 4 years."
According to EPA estimates, the energy savings solution designed by SmartWatt Energy for NOR-AM Cold Storage Logistics will save the equivalent of 151 metric tons of Carbon Dioxide, which is equivalent to the carbon sequestered annually by 32.2 acres of pine forests.
PLANSEE High Performance Materials” has developed a new molybdenum-copper composite material for semiconductor wafer substrates. The high thermal conductivity of MoCu R670 ensures optimized heat dissipation in led high bay light. The new material has the same coefficient of thermal expansion as sapphire, andtherefore reducesdefects in the semiconductor structure which can occur during the hot bonding process.In this way, Mo-Cu R670 helps ensure the reliable production of LED chips and increases the efficiency of the light source.
David Johnson, Plant Manager for NOR-AM Cold Storage Logistics believed that, "Upgrading technology and generating energy savings is a win-win situation. The improvements are estimated to save more than $14,132 annually, which would pay for the project in 4 years."
According to EPA estimates, the energy savings solution designed by SmartWatt Energy for NOR-AM Cold Storage Logistics will save the equivalent of 151 metric tons of Carbon Dioxide, which is equivalent to the carbon sequestered annually by 32.2 acres of pine forests.
PLANSEE High Performance Materials” has developed a new molybdenum-copper composite material for semiconductor wafer substrates. The high thermal conductivity of MoCu R670 ensures optimized heat dissipation in led high bay light. The new material has the same coefficient of thermal expansion as sapphire, andtherefore reducesdefects in the semiconductor structure which can occur during the hot bonding process.In this way, Mo-Cu R670 helps ensure the reliable production of LED chips and increases the efficiency of the light source.
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